🌡️ Thermal Management Products
3 Review
Made of high quality Aluminum, good thermal conductivity.The sticker on the back is easy to tear off. Dimension: 40mmx40mmx11mm/ 1.6' x 1.6' x 0.43'(L*W*T). Can be applied for passive cooling of 3D printers, NEMA 17, TEC1-12706 Thermoelectric Peltier Cooler etc. Easy to installation Extend reliable Service- Life.
3 Review
Suitable for Raspberry pi model, pi 2, pi 3, pi B, pi B+ etc. boards. 5pcs heat sinks for two different sizes, big size: 14mm*14mm*6mm, small size: 9mm*9mm*5mm. Double sides high stickiness hot glue, stick the heat sink to chip better and dissipating heat uniformly. Made of aluminium, cooling groove for fast heat dissipation. Applied for other various…
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3 Review
【Innovation Graphite Thermal Film】: Graphite heat sink is a new type of heat-conducting heat-dissipating material with unique grain orientation and uniform heat conduction in two directions. The layered structure can be well adapted to any surface, shielding heat source and components while improving consumer electronics performance. 【High Thermal…
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3 Review
★Aluminum Heatsink Compatible for laptops and desktop computers. Supports NGFF PCIe NVMe M.2 2280 SSD size: 0.87 x 3.15in. (22 x 80mm), perfectly fit for Samsung 850 EVO, 860 EVO, 960 EVO, 970 EVO, 950 PRO, 960 PRO, 970PRO, Etc. ★NVMe Heatsink passive heat dissipation solution full covering 2280 NVMe SSD(Aluminum Heatsink and Thermal Silica Pad) with 5°C…
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3 Review
Continuous Direct Contact Technology 2.0 - Increased surface by 45% by compressing heatpipes together, helping to dissipate heat more efficiently. Air Flow and Heatsink - 120mm fan, 4 heatpipes, and stacked fins allow cooler air into the heatsink whiles steering extra ventiation to the hotspots. Intuitive Fan Bracket Design – Upgrading and removing…
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3 Review
Air Open - Gravity Close. Weather Stripping for Tighter Seal. For Use With: 42 IN Belt Drive Exhaust Fan.
3 Review
Colorful CN600 M.2 2280 2TB DDR PCIe 3.0 x4 NVMe 3D-NAND TLC (CN600 2TB) NVME 2TB SSD/Colorbox M.2 Form Factor 2280 M.2 / M-Key Interface (PCIe 3.0 x4) RW - 3500/2500 (MB/s) 3D-NAND TLC memory type 640 TRW buffered 2 GB DDR buffer 36 month warranty
3 Review
【Wide Field of Applications】: This thermoelectric cooler can used for plate cooling, pet bed cooling, test bench, small space cooling. 【Multipurpose】: This dual-core cooling system kit can be used as dual-core cooling, air cooling device, cooling equipment. 【Wonderful Characters】: This semiconductor refrigeration cooler kit with power has stable working…
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3 Review
Made of high quality iron, fast heat dissipation and durable. The back is covered with an insulating layer for safe and reliable use. Good heat dissipation to ensure the CPU works properly. Product name: AM4 backplate; Quantity: 1 piece; Material: iron. Screw: 6-32; Applicable: for AM4 platform; Color: black.
3 Review
Suit for AMD AM2, AM3, AM4, FM1, FM2. Size: approx 114 x 70mm / 4.4" x 2.7" (Lx W). Thread: M3 (Mounting screws NOT included).
3 Review
Precise temperature control.No moving parts, no noise, and solid-state. Compact structure, high performance, reliable. Size: 40*40*3.8mm, component logarithm: 127. Wire specification: lead length 100±5mm, RV standard wire, single head 5mm tinned. Very easy to install.
3 Review
Pillar and fin combination provides high performance. Vast compatibility across multiple types of memories. Increases overclocking potential. Pre-applied adhesive thermal tape.
3 Review
6 Pieces Aluminum Heat Sink. Size: 4" x 1" x 0.4"/100mm*25mm*10mm (L*W*H). Unit weight : 33g. Can be used for cooling LED, Power IC and Transistors, etc.
3 Review
Thanks to its excellent thermal conductivity, Hydronaut can be used in the overclocking sector, but it has been specially developed for users with large heatsinks. The convenient syringe makes this Thermal Compound very easy to apply and goes exactly where it should. CPU and cooling, GPU, LEDs, heat dissipating ribbed plates. Thermal Grease perfectly…
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3 Review
The Protronix Series 9 thermal compound paste is 62% more thermally conductive than the Series 7. The high density formula is suitable for extreme environments and applications that demand the very best performance. Exceptional long term stability, odorless, low oil content, non-curing, non-volatile, non-corrosive, non-toxic, flame retardant, not…
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3 Review
Type model: TEC1-12710. 5PCS included in a parcel. Easy to install and use. Semiconductor material is sandwiched between the ceramic plates. Widely applications from CPU coolers to alternate power sources. Reverse the polarity to get ice cold in minutes or heat to boiling. Umax (V): 15.4V; I max (A): 10A; Tmax (degree Celsius): 67; Max. power consumption…
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3 Review
➤ High-quality material: Aluminum alloy, silver plating, anodic oxidation surface treatment (Thermal conductivity of the heatsink: 560W/mK). ➤ Compatible with PCIe NVMe M.2 SSD size: about 0.87 x 3.15in. (22 x 80mm) that all can be perfect used, To Fit:M.2 SSD/ NGFF SSD/ NVME SSD/SSD, etc. ➤ Groove design, greatly increase the heat dissipation areas…
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3 Review
40mm anodized aluminum heatsink. Pre-applied 3M 8810 thermal conductive double side adhesive tape backing. Can be applied for passive cooling of 3D printers stepper motor, NEMA 17, TEC1-12706 Thermoelectric Peltier Cooler etc. Dimension: 1.57 x 1.57 x 0.43 inch / 40x40x11mm (L*W*H). Weight: 0.6 oz / 17 gr per pc.
3 Review
40mm anodized aluminum heatsink. Pre-applied 3M 8810 thermal conductive double side adhesive tape backing. Can be applied for passive cooling of 3D printers stepper motor, NEMA 17, TEC1-12706 Thermoelectric Peltier Cooler etc. Dimension: 1.57 x 1.57 x 0.43 inch / 40x40x11mm (L*W*H). Weight: 0.6 oz / 17 gr per pc.
3 Review
Easy to Apply. Great Thermal Conductivity. Built for High Performance.