Again, "chewing gum" instead of solder under the lid! With heat dissipation of 65W and normal implementation of heat dissipation UNDER the cover - these processors could work with a boxed aluminum radiator, and so . we have what we have - we have to install towers to somehow compensate for the "Intel failure" in heat dissipation. Pros: Excellent performance in both games and software, The best option from Intel in price up to 30,000. I donโt see the point in โKโ, because the overpayment is not worth the difference in performance! Some cons: Heat removal from the crystal. The instances are different.
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