Review on Aikenuo Adhesive Performance Heatsink Computer by Ken Coste

I had to remove the heatsink on top of the RAM module to make room for a specific parallel CPU air cooler. Removal with a heat gun and soft tool wasn't a problem, but when I had to reattach the expander the adhesive on the original heat transfer became quite weak. I managed to close everything but when I checked again a week later it was a little loose. It's time to replace the thermal pad. I was using a reassembled module at the time of this purchase, so I was unable to take a measurement. I chose 20mm as it was the closest I could remember. The width was perfect (Fig.). You must remember that this is not rubber, it is foam. Installed on both sides of the module, being careful not to let this new material sag between the chips. THIS STUFF is sticky! It's also less stiff than the original thermal pad and is difficult to cut even with good scissors. Xacto made it much easier. I'm happy to report that the temperatures on all modules appear to be the same and are stable again. Yes, there were temporary inconsistencies with bare RAM that caused instability with my aggressive overclocking. I'm glad I found this. I'm just wondering what to do with the other 15 feet! 😄