Description of ASUS ROG MAXIMUS XIII HERO motherboard
Ample cooling options, a power system optimized for the latest AMD Ryzen processors, support for high-speed memory and drives - these and other advantages implemented in the TUF Gaming B550-Plus motherboard will allow you to unleash the full potential of the components used within the gaming system.
DrMOS Power Modules Power System The processor power system implemented on the TUF Gaming B550-Plus motherboard uses 8+2 DrMOS power modules, each of which includes a driver, lower and upper MOSFET switches. This integration of components delivers the increased efficiency required for the stable operation of 3rd Gen AMD Ryzen processors. Stack Cool 3+ Technology Thoughtful PCB design using copper layers for heat dissipation helps to reduce component temperatures, which is especially important for overclocking Improved 8-pin power connector Special ProCool power connectors used on ASUS motherboards ensure reliable cable connection , reduced electrical resistance and improved heat dissipation compared to standard.
TUF Series Components TUF Inductors Conforming to strict military-industrial standards, TUF inductors deliver the most stable current to the CPU, which improves overall computer reliability. TUF Capacitors Exclusive Capacitors Boast High Temperature Resistance and Extended Lifespan DIGI+ PWM Controller The digital power system regulation implemented on this motherboard guarantees stable operation and high power efficiency.