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CS FLUX Reballing Viscosity Component 10G Review

1

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Very good

Revainrating 4 out of 5  
Rating 
4.0
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Description of CS FLUX Reballing Viscosity Component 10G

CS-FLUX when heated at around 150 degrees (Celsius) turns into liquid and covers the small gap between the BGA component and the PCB complitelly. This way all solder balls are covered with CS-FLUX and durring reflow or removal of the BGA componets all PCB and componet pads and balls are protected. CS-FLUX is no clean flux and causes no corrosion if not cleaned but it can be cleaned easily with alcohol. Thank's to it's liquid nature, a very small amount of CS-FLUX is needed for each repair resulting in a much cleaner work enviroment. CS-FLUX is very sticky and specially designed to keep the solder balls inside the stencil durring the reballing proccess. It is also ideal for reflow of BGA components (with heatgun) when needed equipment for reballing is not avaliable. CS-FLUX is produced in EU (Greece) and will be shipped to your workshop very fast.

Reviews

Global ratings 1
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Type of review

Revainrating 4 out of 5

The current flows in the direction of heat.

The product has served its purpose. The material came out in the form of a gel, but spread quickly with a bit of heat. Flux was used to "mourn" a small chip on an audio receiver board.

Pros
  • Due to its liquid nature, only a very small amount of CS-FLUX is needed for each repair, making for a much cleaner working environment.
Cons
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