Review on 🔥 Flirc Raspberry Pi 3B Case: Optimal Protection and Cooling Solution by Kenneth Murphy

I loved the Flirc Gen 1 case (made for rpi2) and should have gotten this update when I saw it! I love the new finished product! Here are the improvements over the Gen1 case: * It's slightly shorter * Improved SD card access * Larger (and properly placed) heatsink * Better ventilation on the bottom (holes instead of slots) * Defined cutouts for USB and Ethernet -Connectors * Comfortable feel I replaced the thermal pad that came with the case with the Fujipoly Ultra Extreme XR-m (17.0 W/mK) thermal pad to improve heat conduction from the CPU to the case/heatsink. I used size 1.5 and it fits very tight which I like. Below are the stress tests I ran using CPU Burn (the most stressful CPU test ever) at a normal clock speed of 1.2 GHz. 34.3 C* Completed 15 minutes at 63.4 C Chassis + Fujipoly + fan (exhaust) CPU Burn Stress Test* Started at 34.3 C* Completed 15 minutes at 59.1 C Chassis + Fujipoly + fan (exhaust) Stress - CPU Burn Test* Started at 33.6 C* finished 15 minutes at 56.9. Overall, I can say that I am very satisfied with this case! For me there are no cons at all! I would recommend this to anyone looking to run retro gaming, media, etc for a long period of time. Overclocking is also possible with this case.