Be careful using correct thickness heating pads. The product is designed for several "versions" of the Raspberry B, and the manufacturer offers several heating pads. For Model 3 B (not Plus), the protrusion of the processor chip heatsink DOES NOT touch (DOES NOT CONDUCT HEAT) when using only thick or thin standoffs. My 3B required BOTH a large square, thick and thin, to make contact. Just make sure you remove the protective cover from the thermal pad. There are two more standoffs for my 3B: A thin tiny square goes to another chip on top of the processor. Tape the chip to make sure it lines up with the square edge of the heatsink. Another thermal pad - square (thicker) goes to the back of the chip and extends from the radiator bar to the chip. UPDATE: I bought another one for my 3B+. I used both thin ones for the "top side" chips including the metal processor. And a thick, larger square for the chip on the back. ALL have good contact. I'm still not entirely "satisfied" with the two thermal pads on the Model 3 processor, but it seems to dissipate heat and the 3B doesn't get as hot. In addition, the first set of radiator seals seemed "crumbly", the second ones were good and active. Raised my rating from 4 to 4.5 (so yes, 5 star basket).
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