Review on Cosmos Copper Cooling Heatsinks Cooler by Anferny Pineda

All 8 on my RX 5700 GPU use AIO with a fan blowing across the board. Using self-adhesive thermal pad instead of hot melt glue. Modules do not exceed 100 degrees Celsius. Often found in the 70-90 degree Celsius range. Poor cooling of the memory module compared to the reference fan. My guess is that the cooling isn't as good as hoped because GDDR6 is a flip-chip module, meaning the heat-generating silicon is closer to the PCB than the top of the module's memory plastic cover. If I had attached the copper heatsinks to the memory module differently, the cooling could have been better. Something that has a higher thermal conductivity than a gasket and keeps the heatsink closer to the module. To be honest, I'm very happy with it. I use thermal pads because I don't need a permanent solution to attach heatsinks to the GPU. Just note that it doesn't make a significant difference to GDDR6 compared to a standard cooler or even an external fan. With these heatsinks you need some GDDR6 airflow.