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<|endoftext|> Field of the Invention
More specifically, the present invention relates to the formation of low resistance silicide contacts.
Description of the Related Art
Consequently, electrical interconnects within such integrated circuits must be able to carry ever-increasing amounts of current, while maintaining acceptable contact resistance values between metal lines and underlying doped regions (e.g., N+ source/drain regions).
As a result, lower resistance metals such as titanium (Ti), cobalt (Co), nickel (Ni), and platinum (Pt) are being considered as replacements for Al and W