Review on 💡 GENNEL 10g Thermal Conductive Adhesive, Silicone Thermal Plaster for Efficient Cooling of LED, GPU, MOSFET, Chipset, Heatsinks by Will Anderson

I bought this glue in June 2018 and used it for the first time in the last few days to build homemade radiators. and apply them to NVME SSDs. Before gluing the pieces together, I overlapped 1100 square pieces of 1100 aluminum using moderate pressure. A bond gap of 0.001 inch was measured with vernier calipers. With a thermal conductivity of 1.2 W/mK, this joint thickness has negligible thermal resistance for my application. The parts were bonded at a humidity of 30% and a temperature of 70 °C. Q. The adhesive did not "flow" or increase in viscosity during the approximately 15 minutes that I was working with it. Viscosity causes problems. This is especially true for parts glued to PCB components, as high clamping forces can damage the PCB. Silicone (polysiloxane) adhesives require moisture to cure, and this moisture can be provided from the atmosphere or adsorbed moisture. on bonded surfaces. Thin joints harden faster than thicker ones. If you cannot leave the parts to be bonded alone for at least 24 hours, metal and/or plastic is recommended and check the strength of the bond with test specimens before you put the bond into operation. It is also recommended to clean the surfaces to be bonded with a cotton swab and isopropanol and/or acetone (not suitable for some plastics), as the solid filler used to increase thermal conductivity reduces the flowability and wettability of the silicone adhesive. TUNE FL. Two pieces of copper were cleaned, bonded and tested after 24 hours of curing (see photo). The lap joint (0.3 inch) withstood a 10 lb shear force but failed at a 20 lb load. The adhesive inside the damaged joint was still ductile, indicating that the joint had not fully cured; However, for my application, the connection was strong enough.