Update: This case was too nice to send back , so I canceled the return and applied 3rd party thermally conductive silicone pads to the chips and case in the locations indicated in the documentation. After assembly, the case cools the components much better. --------- This case did not deliver the claimed cooling without the use of "extra" thermal paste. The device still reaches "gas" temperature within five minutes under load. Maybe lube would work better, but that would be very messy on a device that's meant to be opened multiple times. Thermal pads would be a better option. However, I can't say if they would have improved thermal conductivity.
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