Iceberg Thermal FUZEIce Heatsink Compound Review

Hastily dispersed according to Derbauer's video, five passes for pasta dough. Before it, on the old one, which had become attached for two years, the ZhM, from the first pass, exceeded 100 degrees.

The results in comparison with the AC MX-4 (which was already old, but still saved my situation at the moment (bought in 2022) are not impressive in favor of the new product: AC MX-4 - 39-41 in idle, Iceberg Thermal BLACKIce - 49-51 in idle. Checked 2 times - errors are excluded. Stress tests AC MX-4 - 63-64, Iceberg Thermal BLACKIce - flew over 74, which is unacceptable for my system. And yes - this is not advertising, I know that AC MX-4 becomes unusable in about 7-8 months. And the "online…

As an industrial electrician, I`m constantly searching FOR products that can provide reliable thermal management solutions. My analysis of this product showed that it is an excellent option for keeping electronic components cool. The compound has exceptional heat conductivity resulting in impressive cooling performance. The ease of application is its biggest pro and the only con being that it requires frequent reapplication. Nonetheless, this product is an outstanding choice for anyone who…

Thanks to my knowledge gained in practice, i can confidently say that this thermal compound provides efficient heat transfer, enhancing system performance... Its low viscosity makes it easy to apply without damaging components. However, it can get messy if not handled carefully. Overall, I recommend this thermal solution for effective thermal management in any industrial setting..

Used for my CPU. As a GPU I would recommend Noctua. In my testing of a hot 5700xt it's 2-3s lower. I would spend my good stuff (Noctua) on something that idles around 30 degrees and needs a lot of use. Iceberg Thermal FUZEIce lays down in a thick layer and does not push out. I think it's due to the rise in temperature. Noctua just flows out like water. 2 types of thermal paste. It's good to have both for different applications.