Review on 🔥 Enhanced Thermal Conductivity Encapsulating Solution by MG Chemicals by Joshua Mejia

For filling some Denso HID ballasts. Uses about 30ml of each part, 60ml total for each ballast. I followed the instructions pretty closely. I started by pouring each serving into clear measuring cups. Then pour them into paper coffee cups, stir and let sit for 30 minutes. This allows air bubbles to escape upwards. I then slowly and carefully poured the epoxy into the ballasts, repeatedly coming back to the areas to pop the bubbles and add more as it settled. The process took about 30+ minutes per ballast as I watched and waited for the bubbles to appear. Room temperature cure time is a bit crazy, 96 hours. Luckily I'm taking my time and they have 48 hours left at the time of writing this review. They're pretty hard as they are now, but there are a few tiny bits of softening, if any. I wish the price was cheaper but you get what you pay for. I know these Denso ballasts should last a very long time, especially with this epoxy. I have many more cases so I can risk it and then resell it. I highly recommend this stuff!