Fast heating/cooling. Variable temperature is pretty accurate. First I booted up a MEMS microphone chip (MP34DT05) at 265C and soldered another identical board. High temperatures are no joke here. The microcircuit is supplied exclusively in the HCLGA package. The chip was protected from 200 C, and when the temperature rose to 220 C, the job was done quickly. I used solder 247-SNPB-15 which has a melting point of 183Β°C. Given the heat dissipation from the bottom, I would say that the air gun coped adequately with the task.