I'm not a fan of bismuth/tin solders. I'd say unless you specifically need this formula, it's best to stick with regular lead-free paste. It just doesn't have the flowability and surface tension of traditional solders. It seems easy (I stenciled it) and fun to work with, but I've spent all day adjusting the temperature profiles in the reflow oven and I just can't get it to look that nice and clean. as a classic lead or lead-free alloy. It has trouble wetting itself into a large, continuous ball of metal, and does so despite adjusting the soak time and TAL throughout the day, and even applying a heat gun to it. He just lets the balls lie. This may be normal for widely spaced components, but I can say I don't trust that for 0.8mm.
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