The pads are soft, which is needed when placing heatsinks on chips, and effective! The problem, however, is that it's only packaged in a thick cardboard sleeve that's only slightly larger than the notebook itself. This shrinks all of the edges, making the already small pad appear visually smaller. The Gelid guys have to make small bends in the cardboard, or even better, put a plastic border of the same thickness around the pad to keep the thickness constant. If you need to use the entire spacer for your project, you may need to purchase two (depending on how carefully the packages were handled upon delivery).
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