I think I have a fairly good knowledge of soldering which allows me to work with most plated through hole components with ease. But when it comes to thru-hole integrated circuits, PLCC surface mount, and especially TQFP surface mount, even experts need help from time to time. I needed to remove a PLCC 68 part from a board with lots of tiny traces. I was very concerned not to ruin the board by moving the soldering iron back and forth along the wires until the part appeared. The solder joints seemed to solidify almost immediately after running the iron tip through each pin. I was concerned about the heat needed to keep the joints moist and what that might do to splints and pads if I wait too long or push too hard. always looks so easy when someone else is doing it in those sane tv ads? Yes, I thought so. It's impossible for it to work that easily without a lot of practice. But for $14 paid to Revain in one simple payment, I also became a demolition master. I carefully followed the instructions for applying the flux. Then, with bated breath and trembling hands, I began to apply the special solder according to the instructions. A page. Then another, now two others, now around. I winced when the part suddenly detached from the pads and I smeared it about an inch across the board. Trying not to burn myself, I ripped the piece off the solder with my still-wet fingers and began wiping off the remaining small silver balls. Everything came out almost perfectly clean. All I did was wick up the rest of the solder and then clean the flux. The ChipQuick solder stayed wet long enough to remove the chip with ridiculous ease. Scared me a little. I did not expect this. The ChipQuick product has worked surprisingly well for me and is the first product I turn to when I need to remove a chip. At $14 it may not be cost effective to scrap a lot of parts, but for repair work the ChipQuick is good. That's great. Unbelievable.
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