Another example of "chewing gum" being used in place of solder under the lid! If these CPUs had a heat dissipation of 65 watts and a typical implementation of heat dissipation UNDER the cover, then they would be able to work with a boxed aluminum radiator. We are stuck with what we have, which is the requirement to set up towers as a means of making up for what we refer to as "Intel's failure" in terms of heat dissipation. Some pros: An outstanding achievement in both the games and the software, The greatest choice available from Intel for a budget of up to 30,000. In my opinion, "K" is a waste of money because the additional payment is not justified by the marginal improvement in performance. Below are some downsides: Elimination of heat from within the crystal. The situations are distinct from one another.
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