Review on 💎 Enhanced Nanodiamond Thermal Paste Conductivity Performance by Richard Payne

This thermal compound is ideal for use in laptops, GPUs and other low radiator mounting pressure and/or imperfect surface finish situations. In such cases, the thickness of this paste and the nanodiamond content ensure excellent heat transfer and prevent "pumping" due to temperature changes (which usually occurs with thin thermal compounds). The main downside to its performance is that this thermal paste isn't as easy to apply as popular less efficient products like MX-4. This paste is nice and soft when it comes out of the syringe, but it has a fairly dry consistency and tends to stick together if you try to apply it in a thin layer. Experienced builders can apply this paste evenly, but most people are probably better off using dot or line application methods. When used, the paste works as expected. With a thermal conductivity of 16 W/mK it is among the best non-conductive pastes and the temperatures reflect this. It's too early to tell how this paste will perform over the long term, but I have no reason to doubt it given its high viscosity and diamond content. Overall, this is a great thermal paste for imperfect heatsinks (especially laptops). Of course it's fine on a desktop processor too, but contact/pressure is usually much better in this situation, so I usually stick with cheaper, easier-to-use products.