The current CPU is well overclockable, solder under the lid, and not Intel cheating with "chewing gum" in the overclocker series (hello 8600k, 8350k, 9350k, etc.). Some pros: The optimal ratio is cost / performance / energy consumption. Solder under the lid - no need to scalp and collect percent if there is no task of extreme overclocking. I came across just an amazing copy (despite the fact that KF are considered a "rejection" of K with less potential). Maybe it's the new revision R0 (originally released P0). 5.0 GHz takes and passes all tests at 1.312V (no AVX bias). At the same time, temperatures in most tasks (working applications, games, rendering tests) are in the range of 60-65 degrees, consumption is up to 130W (in games 50-90W). This is with a single-section LSS. In synthetics like Prime and LinX, of course, temperatures will be at least 10-15 degrees higher. Before that, there was a 4-core 8350K, the difference in most modern games is actually not too big (the same 5-10% is easier to get with a video card upgrade), but in a number of titles tailored for multithreading (Kingdom's Come, Assassin's Creed, Watch dogs, Tomb Raider), the difference is of course significant, primarily the absence of the "saw" effect (when the picture twitches a lot due to constant frame jumps). Its cons: With the release of the 10th series, assembling 9600 from scratch loses all meaning, the percentage is interesting precisely as an upgrade on socket 1151/1151v2. In terms of performance, the new 3rd series (4 cores 8 threads) is close to 6 cores/threads of the 9th series, but it costs less. And the same i5 10400 (12 threads) will already outperform the 9600 in most tasks, with lower system requirements (power supply + motherboard element base).
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