Description of π₯ Enhanced Performance Heatsink Interface for TF4 Compound
[Better than liquid metal]: composed of carbon micro-particles which lead to an extremely high thermal conductivity. It guarantees that heat generated from the CPU or GPU is dissipated efficiently. [Safe application]: The TF4 is metal-free and non-electrical conductive which eliminates any risks of causing short circuit, adding more protection to the CPU and VGA cards. [High durability]: in contrast to metal and silicon thermal compound, The TF4 does not compromise over time. Once applied, you do not need to apply it again as it will last At least for 8 years. [Easy to apply]: with an ideal consistency, The TF4 is very easy to use, even for beginners. [Thermal compound]: Formula, the TF4 guarantees exceptional heat dissipation from the components and supports the stability needed to push your system to its limit.